Features:-
• 4pin DIP package
• Double transfer mold package (Ideal for Flow Soldering)
• High collector-emitter voltage (VCEO:80V(*))
• Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V)
• Several CTR ranks available
• High isolation voltage between input and output (Viso(rms) : 5.0 kV)
Application:-
• I/O isolation for MCUs (Micro Controller Units)
• Noise suppression in switching circuits
• Signal transmission between circuits of different potentials and impedances
Specification:-
Symbol | Parameter | Value | Unit |
IF | Forward current | 50 | mA |
PD | Power dissipation | 70 | mW |
VR | Reverse Voltage | 6 | V |
Tstg | Storage temperature range | −55 to +125 | °C |
TOPR | Operating Temperature | −30 to +100 | °C |
TSOL | Lead Solder Temperature | 260 for 10 sec | °C |
IFM | Peak forward current | 1 | A |
VCEO | Collector-emitter breakdown voltage | 80 | V |
VECO | Emitter-collector voltage | 6 | V |
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